Issues | Application Examples | Effect | |
---|---|---|---|
Application Areas | Shield electrical/magnetic waves leaking through circuit components and wiring or apply grounding path formation/step compensation |
Conductive Fabric Single-sided, Double-sided Tape SSC30D : Step Compensation, Grounding SDC80H : FPCB Fixed, Grounding |
|
Solution |
SSC30D | ||
---|---|---|
Item | Spec. | Test Result |
Thickness (mm) | 0.03±0.01 | 0.034 |
Adhesion (gf / 25mm) | > 600 | 922 |
Surface Resistance (Ω/sq) | < 0.2 | 0.095 |
Volume Resistance (Ω/in2) | < 0.2 | 0.008 |
Issues | Application Examples | Effect | |
---|---|---|---|
Application Areas |
|
|
|
|
|
||
|
|
AT55CB | ||
---|---|---|
Item | Spec. | Test Result |
Thickness (mm) | 0.055±0.01 | 0.056 |
Adhesion (gf / 25mm) | > 800 | 1,385 |
Surface Resistance (Ω/sq) | < 0.2 | 0.095 |
Volume Resistance (Ω/in2) | < 0.2 | 0.008 |
Issues | Application Examples | Effect | |
---|---|---|---|
Application Areas |
|
|
|
|
SNF-015FH | ||
---|---|---|
Item | Spec. | Test Result |
Thickness (mm) | 0.15 ± 20% | 0.145 |
Adhesion (gf / 25mm) | > 1,100 | 1,328 |
Surface Resistance (Ω/sq) | < 0.2 | 0.045 |
Volume Resistance (Ω/in2) | < 0.2 | 0.013 |
Issues | Application Examples | Effect | |
---|---|---|---|
Application Areas |
|
|
ACC-100 | ||
---|---|---|
Item | Spec. | Test Result |
Thickness (mm) | 0.1 ± 0.01 | 0.103 |
Adhesion (gf / 25mm) | > 1,200 | 1,500 |
Surface Resistance (Ω/sq) | < 0.1 | 0.05 |
Permeability [at 3MHz] | 80 |
Item | Unit | Spec. | Test Method |
---|---|---|---|
Total Thickness | mm | 0.50 ~ ± 20% | Vernier Cailpers |
Adhesive Force (Conductive Tape) | gf / 25mm | Over 1,200 | KS T 1028 (SUS304) |
Surface Resistance (Conductive Fabric) | Ω / sq | Less 0.1 | MIL DTL 83528C |
Compression Set | % | Over 30 | Samsung Method |
Color | - | Gray | - |
Use Temp. | ℃ | -10 to 80 | ASTM D 3330 |