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Thermal Solution

Thermal Solution

Thermal Spread Tapes
GLPCB (Full Length Head Lamp)

Thermal Spread Tapes

	Issues	Application Examples		Effect
Application Areas	Ap chip and DDI, heat generation in OLED part			Cu Thermal Spread Sheet widely disperses heat from the heating part, lowers the exothermic saturation temperature, and blocks the heat from the heating part from being conducted to the OLED as much as possible EMI noise shielding generated by AP chip on Main Board Cu Thermal Spread Sheet + Foam Tape can be integrated
Application Areas	Thermal and EMI noise problems of IC chip			Relieves EMI noise shielding and heat generation generated by AP chip of Main Board
Solution	Conductive tape on top of IC Chip or SUS Cover Shield -> EMI Noise Suppression Thermal Spread Tapes are applied to spread the heat of the heating part to reduce the saturation temperature

GLPCB (Full Length Head Lamp)

Description: For partial heat dissipation of the LED Module FPCB applied to the front and rear lights of automobiles, the AL 1.0T is currently in use in series production. Apply this as GFPCB (FBCB + Al_GCL)

Product Detail

Graphene lamination technology, Binder dispersion and coating technology composite new material
Compared to the existing mass-produced laminated structure, unit cost competitiveness and excellent heat dissipation performance
Can be designed for various shapes and thicknesses required by the product

Specification

Item	Unit	Value	Remark
Total Thickness	mm	0.050 ± 0.010	Digital Upright Gauge
Thermal Conductivity (X-Y axis)	W / mK	Over 200	NETZSCH LFA

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