문제점 | 적용 예시 | 적용효과 | |
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적용부위 | 회로 부품 및 배선을 통해 누수되는 전기/자기파를 차폐 또는 Grounding Path 형성/단차 부위 보상 적용 |
도전 Fabric 단면, 양면 Tape SSC30D : 단차보상, Grounding SDC80H : FPCB고정, Grounding |
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해결방안 |
SSC30D | ||
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Item | Spec. | Test Result |
Thickness (mm) | 0.03±0.01 | 0.034 |
Adhesion (gf / 25mm) | > 600 | 922 |
Surface Resistance (Ω/sq) | < 0.2 | 0.095 |
Volume Resistance (Ω/in2) | < 0.2 | 0.008 |
문제점 | 적용 예시 | 적용효과 | |
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적용부위 |
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AT55CB | ||
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Item | Spec. | Test Result |
Thickness (mm) | 0.055±0.01 | 0.056 |
Adhesion (gf / 25mm) | > 800 | 1,385 |
Surface Resistance (Ω/sq) | < 0.2 | 0.095 |
Volume Resistance (Ω/in2) | < 0.2 | 0.008 |
문제점 | 적용 예시 | 적용효과 | |
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적용부위 |
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SNF-015FH | ||
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Item | Spec. | Test Result |
Thickness (mm) | 0.15 ± 20% | 0.145 |
Adhesion (gf / 25mm) | > 1,100 | 1,328 |
Surface Resistance (Ω/sq) | < 0.2 | 0.045 |
Volume Resistance (Ω/in2) | < 0.2 | 0.013 |
문제점 | 적용 예시 | 적용효과 | |
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적용부위 |
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ACC-100 | ||
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Item | Spec. | Test Result |
Thickness (mm) | 0.1 ± 0.01 | 0.103 |
Adhesion (gf / 25mm) | > 1,200 | 1,500 |
Surface Resistance (Ω/sq) | < 0.1 | 0.05 |
Permeability [at 3MHz] | 80 |
Item | Unit | Spec. | Test Method |
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Total Thickness | mm | 0.50 ~ ± 20% | Vernier Cailpers |
Adhesive Force (Conductive Tape) | gf / 25mm | Over 1,200 | KS T 1028 (SUS304) |
Surface Resistance (Conductive Fabric) | Ω / sq | Less 0.1 | MIL DTL 83528C |
Compression Set | % | Over 30 | Samsung Method |
Color | - | Gray | - |
Use Temp. | ℃ | -10 to 80 | ASTM D 3330 |